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Semiconductor Engineering
semiengineering.bsky.social
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From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible.
https://semiengineering.com/whats-next-for-tsvs/
#semiconductor #TSVs
2025-01-06T16:24:57.258Z